型号:

1120 X 1"

RoHS:无铅 / 符合
制造商:3M描述:TAPE FOIL .002" 1" X 36YDS
详细参数
数值
产品分类 RF/IF 和 RFID >> RFI 和 EMI - 屏蔽和吸收材料
1120 X 1" PDF
MSDS 材料安全数据表 1115,1120 MSDS
特色产品 Thermal Interface Materials
Electromagnetic Compatible (EMC) Products
标准包装 9
系列 1120
形状
厚度 - 总计 0.004"(0.1mm)
1.00"(25.40mm)
长度 108'(32.9m)36 码
胶合剂 丙烯酸,导电
温度范围 -
产品目录页面 549 (CN2011-ZH PDF)
其它名称 0-00-51128-55325-1
00051128553251
05112855325
3M1120C
80-6112-6646-3
80611266463
相关参数
HX1188 Pulse Electronics Corporation MODULE XFRMR SGL ETHR LAN 16SOIC
TX1192NLT Pulse Electronics Corporation MODULE 1CT:2.42CT 1.2MH SMD
MNZB-EVB-A24-UFL MeshNetics BOARD EVAL MNZB-A24-UFL W/RP-SMA
121586-5232 ITT Cannon, LLC LOCATOR OPTION FOR 121586-5229
0097095502 Laird Technologies EMI RFI EMI GROUNDING MATERIAL
SI8461DB-T2-E1 Vishay Siliconix MOSFET P-CH D-S 20V MICROFOOT
IRFS4310ZTRLPBF International Rectifier MOSFET N-CH 100V 120A D2PAK
H0019NLT Pulse Electronics Corporation MODULE MAGNETIC LAN 1:1 10/100
0097054118 Laird Technologies EMI RFI EMI GROUNDING MATERIAL
MAX9985EVKIT# Maxim Integrated KIT EVAL FOR MAX9985
MNZB-DKL-24 MeshNetics KIT DEV ZIGBIT 2.4GHZ LITE 45DAY
MXO45-2C-64M0000 CTS-Frequency Controls OSC 64.0000MHZ CMOS/TTL FULLSIZE
RHP030N03T100 Rohm Semiconductor MOSFET N-CH 30V 3A SOT-89
TX1193NLT Pulse Electronics Corporation MODULE 1CT:2CT 1.2MH SMD
MNZB-DKC-24 MeshNetics KIT DEV ZIGBIT 2.4GHZ COMPLETE
0097097502 Laird Technologies EMI RFI EMI GROUNDING MATERIAL
RHP030N03T100 Rohm Semiconductor MOSFET N-CH 30V 3A SOT-89
0097065502 Laird Technologies EMI CLIP ON PERPENDICULAR GRD STRIP
MNZB-EVB-24-SMA MeshNetics BOARD DEV 802.15.4/ZIGB SMA CONN
3481-6 3M ASSEMBLY NEST